| 產品參數(shù) |
| 品牌 | OKAMOTO |
| 英文名 | wafer grinding |
| 品名 | 晶圓研磨 |
| 別名 | 晶圓拋光減薄機 |
| 產地 | 日本 |
| 加工直徑 | Ф300mm |
| 主軸轉速范圍 | 0~3000rpm |
| 主軸驅動電機功率 | 5.5/4 Kw/P |
| 主軸進給速度范圍 | 1~999μm/min |
| 主軸數(shù) | 2 |
| 工作盤轉速范圍 | 1~300rpm |
| 研磨輪尺寸 | Ф300mm |
| 重量 | 8200kg |
| 可售賣地 | 北京;天津;河北;山西;內蒙古;遼寧;吉林;黑龍江;上海;江蘇;浙江;安徽;福建;江西;山東;河南;湖北;湖南;廣東;廣西;海南;重慶;四川;貴州;云南;西藏;陜西;甘肅;青海;寧夏;新疆 |
| 類型 | 全自動 |
| 型號 | GDM300 | |
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OKAMOTO GDM300晶圓研磨/晶圓拋光減薄機概要：
Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life.A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment.
晶圓研磨/晶圓拋光減薄機GDM300特點：
The process from back grinding to wafer mounting continuously by fully automatic system,
With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
Built in edge trimming system is available as an option for thin wafer process.
Dual index system, which polishing stage and grinding stage is completely separated,
satisfy the cleanness required for TSV and MEMS process.
Less than Ra1? ultra luminance, ultra mirror surface is possible.
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